Quantenna and Texas Instruments Collaborate to Develop Industry Leading LTE and Wi-Fi Solutions for Enterprise and Pico Small Cell Base Stations

MOBILE WORLD CONGRESS – BARCELONA – February 24, 2014 - Quantenna Communications, Inc., a leader in ultra-high performance Wi-Fi solutions, and Texas Instruments (TI) (NASDAQ: TXN) announced today their collaboration on solutions for enterprise and pico small cell base stations. These platforms will integrate Quantenna’s latest award-winning QSR1000 802.11ac 4x4 Multi-User Multiple Input Multiple Output (MU-MIMO) chipset and TI’s highly-integrated KeyStoneTM-based TCI6630K2L System-on-Chip (SoC) for enterprise and pico small cells. When combined these solutions create the highest performance 3G/4G cellular with Wave 2 802.11ac and 802.11n Wi-Fi solution for the small cell market.

With Quantenna’s 4x4 802.11ac Wave 2 technology, TI and Quantenna have enabled the industry’s most optimized BOM and highest performance Wi-Fi and LTE solution. Quantenna’s unique Wi-Fi architecture capable of 1.7Gbps delivers the performance needed for indoor and outdoor small cells with 802.11ac and 802.11n dual concurrent solutions, while utilizing the TCI6630K2L’s integrated network co-processor and completely offloading the ARM® Cortex® -A15 CPU cores.

“We are thrilled to collaborate with TI to enable this small cell platform and we expect to see more Wi-Fi and LTE converged applications in this exciting and fast growing small cell market,” said Lionel Bonnot, senior vice president, business development, Quantenna. “Indoor and outdoor Wi-Fi enabled small cells will benefit from our best in class performance, reliability and coverage.”

“Integrating high performance Wi-Fi into LTE small cells is a high priority for both OEMs and operators,” said Cal Parsons, marketing manager, small cell processors, TI.  “Quantenna’s 802.11ac Wave2 solution paired with TI’s TCI6630K2L SoC creates a unique architecture that provides our customers with industry leading performance and efficiency across LTE and Wi-Fi platforms.”

TI’s innovative technology paired with Quantenna’s 802.11ac solution allows OEMs to deliver differentiated enterprise and pico small cells to the market faster. TI is showcasing the first solution board in their meeting room at Mobile World Congress in Barcelona, Spain from February 24-27.

About Quantenna Communications, Inc.

Quantenna is a leading developer of 802.11ac and 802.11n Wi-Fi semiconductor solutions that deliver the performance, speed and reliability of wired Ethernet for multimedia data anywhere. Quantenna pioneered the delivery of seamless video over Wi-Fi and set the performance standard for delivering wire-like quality HD video reliably throughout the connected home, for which it has amassed a list of major awards, including being named a “Top 5 Start-Up for 2013” by The Wall Street Journal. Founded in 2006, Quantenna has shipped millions of its Wi-Fi chipsets being deployed by major telco, cable and satellite service providers and operators worldwide including AT&T, DIRECTV, Bell Canada, Swisscom, Telefonica, France Telecom and Belgacom. Quantenna is headquartered in Silicon Valley, with offices worldwide. For more information, visit www.quantenna.com.

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